Electronics Forum | Fri Oct 18 16:24:05 EDT 2002 | russ
Big BIG BIGG wave with a lot of preheat capability both top and bottom. You may need to exceed the standard "100 C" top side preheat to 120C or so (be aware of any topside SMT going into reflow over the wave). A spray fluxer with very fine atomizati
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Thu Jan 08 14:33:50 EST 2004 | dwzeek
Toe fillets are not required per IPC. Toe fillets could be used as a process indicator, if you desire; I would not. Gull wing leads are typically cut off on the ends when manufactured; this exposes the non-plated material in the lead, typically coppe
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw
Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
Electronics Forum | Wed Mar 08 17:51:27 EST 2006 | pms
Chunks nailed it. You should not expect to see a perfect side fillet on this part, especially using no-clean, it's probably bare copper, hard to wick solder up the side of the lead.
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Fri Jul 10 07:34:00 EDT 2020 | elijah
From the poor bonding strength of the board, the surface quality problems of the board are divided into: 1. The cleanliness of the board surface; 2. The problem of micro graphite (or surface energy) on the surface. PCB circuit board proofing Youke bo
