Electronics Forum: copper leached from solder (Page 6 of 58)

Unsoldered gold pads on unleaded wave solder process

Electronics Forum | Wed Jun 13 16:51:26 EDT 2012 | davef

Sorry, but I don't have a quick and easy answer. Before jumping the 'black pad shark,' tell us more about your boards ... * Is the gold still on the pads after soldering? * Can you make the pads take solder using a soldering iron? * Does this happen

Wave soldering problem - strange colour of the solder

Electronics Forum | Tue Jan 16 07:17:20 EST 2007 | adamp

I have checked pot temperature in different parts of solder pot and it looks like it is correct (250C). I have also lowered solder pot temperature and removed copper from the surface of the solder pot (operation repeated couple times). There is still

Unsoldered gold pads on unleaded wave solder process

Electronics Forum | Thu Jun 14 04:24:32 EDT 2012 | brettrenishaw

Yes pads are still gold after the wave soldering process even if you wave solder a pcb several times. I have tried soldering using an iron and the solder takes to the pad as you would expect. This happens on all boards of this type and all boards are

leadfree solder content to avoid wire being thin

Electronics Forum | Tue Feb 28 10:18:35 EST 2006 | Steve Gregory

I just went through the same problem. We have an inductor that is made with a bundle of 30-strands of Litz wire that is vaccuum coated with varnish, and have the ends of the wire bundles tinned that we have to solder to SMT pads on the board. The ind

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020

Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F

| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.


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