Electronics Forum | Wed Apr 07 08:28:41 EDT 2004 | Dougie
Hi, We are Scottish manufacturing company considering a move to Immersion Silver finished PWB's from HASL. The driver behind it being the RoHS and WEEE legislation in Europe at present. My question is... We plan on using a Sn/Cu/Ni solder bar in o
Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Thu Dec 22 10:37:05 EST 2005 | mark
Pete is correct. Lead from the "Leaded" parts will leach into the solder pot and eventually the Pot will become contaminated with unacceptable levels of lead. At that point the entire pot will have to be emptied and cleaned. NOT a fun thing to do!!
Electronics Forum | Fri Feb 25 18:13:17 EST 2005 | davef
Your leadfree dross should float, similar to your leaded dross. It's possible you're thinking about the process for removing excess copper from the solder pot. Following the same process, with: * Leaded solder, the copper floats. So, you scoop the
Electronics Forum | Wed Dec 06 21:36:13 EST 2006 | davef
It's surprising that you have that much copper. Copper contamination of leadfree is usually tolerable up to 1%. So, the copper is moving from the pad to the solder ball. Right? If that's correct, the pad requires a buffer material between it and
Electronics Forum | Fri Mar 24 11:12:06 EST 2006 | patrickbruneel
You�re a good man Rob and a good patriot, you defend your governments decisions even if they're wrong. Isn't the WEEE directive aimed at preventing electronics ending up in a landfill? This immediately takes away the leaching arguments and is a great
Electronics Forum | Thu May 04 10:35:24 EDT 2000 | Sal
THE TERMINONOLY I USED SEEMS TO BE INCORRECT , I THINK THE TERM I WAS LOOKING FOR IS WICKING . BACK TO THE PROBLEM , ISSUES WITH RESNETS, WHERE THE SOLDER PASTE SEEMS TO BE WICKING AWAY FROM THE TERMINATIONS OF THE COMPONENT TOWARDS THE VIAS WHICH AR
Electronics Forum | Mon Dec 04 20:57:09 EST 2006 | callckq
Hello, I did EDX on BGA just to find out copper wt% at the package- ball interface. Is wt% ranging from 20 to 32 considered as normal?? As far as I know lead free BGA and solder paste just have little copper..Where is this excess copper come from
