Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel
Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.
Electronics Forum | Wed Jan 21 17:43:04 EST 2004 | Kris
Hi, I had the same question. In our case we are contacting the copper with the osp coating (not soldered). any published reports that we can reference Thanks
Electronics Forum | Thu Jan 22 08:48:42 EST 2004 | patrickbruneel
Kris, You will need to change your probes to "bite" into the surface twisting probes specialy designed for copper surfaces. The surface hardness of copper is a lot higher compared to tin. link to article from osp manufacturer (see page 5) http://www
Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef
Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.
Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Wed Dec 07 11:16:47 EST 2005 | pete_d
I'm curious to know, if using the same paste and profile,would this phenomena would occur on Copper OSP boards...any input?
Electronics Forum | Fri Sep 24 12:37:13 EDT 1999 | Terry Burnette
.032" pitch, and OSP copper pads on boards with devices that have
Electronics Forum | Fri Sep 24 14:02:02 EDT 1999 | Earl Moon
.032" pitch, and OSP copper pads on boards with devices that have
Electronics Forum | Mon Sep 27 08:45:42 EDT 1999 | Wolfgang Busko
.032" pitch, and OSP copper pads on boards with devices that have
Electronics Forum | Mon Sep 27 09:42:08 EDT 1999 | Earl Moon
.032" pitch, and OSP copper pads on boards with devices that have
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