Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel
BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat
Electronics Forum | Tue Apr 24 09:19:51 EDT 2018 | vetteboy86
Is there a preferred method among printed circuit board assembly for accurately and quickly verifying the copper weight of a printed circuit board? I would like a tool and process that our quality inspector could quickly use to verify upon receipt of
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F
Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l
Electronics Forum | Wed Nov 23 08:43:48 EST 2022 | charles_nguyen
I am having problem with plated hole-copper spacing. I don't know if the gap between plated hole and copper can meet the capacity of PCB manufacturers. My board have 0.5oz copper weight on outer layer and distance of 0.177MM between plated hole and c
Electronics Forum | Thu Aug 12 00:17:15 EDT 1999 | DLKearns
Wanted to know if there was a good "to go by" tip other than the customers(if it helps current req.,10% of 30% of trace) requirements, about pits in the traces on copper plated ceramic substrates? More to the point how many is too many regardless of
Electronics Forum | Tue Apr 22 12:33:35 EDT 2014 | barryg
No we have a battery spring that is soldered directly to a PCB (standard tin plated copper PCB). The Battery spring supplier (and I have no confirmation he makes them or buys them) claims they are tin plated. When trying to solder to them it is very
Electronics Forum | Tue Mar 09 22:26:17 EST 2004 | davef
You should to be soldering to the nickel. The intermetallic is Ni3Sn4. "At relatively low temperatures, the tin-nickel layers form about as rapidly as the tin-copper layers do, but at higher temperatures their growth rate is distinctly lower. At 10
Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Thu Jan 29 05:13:35 EST 2015 | neeraj_iiser
how to solder manganin 0.05mm manganin wire to a copper plate
