Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob
Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger
Electronics Forum | Wed Jun 21 08:31:36 EDT 2006 | don dawson
Depending on the material, the etching can damage the dielectric. This can be manufactured but is difficult and expensive. Copper plating and other processes that require agitation are almost impossible.
Electronics Forum | Fri Jan 21 19:20:31 EST 2022 | SMTA-64304163
Can someone who designs IMS printed circuit boards advise us on how to document the materials on the drawing. We are looking for applicable specifications to reference along with the physical specs. The current design is 066 +/-.006. .059 al, .0028
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams
The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi
Electronics Forum | Fri Oct 26 17:01:52 EDT 2001 | davef
We process no Teflon boards. Companies, such as Rogers and Taconic, make laminates of Polytetrafluoroethylene [PTFE] er �Teflon�. Common �Teflon� laminates are: * Woven glass / PTFE * Random microfiber glass / PTFE * Ceramic / PTFE * Woven glass /
Electronics Forum | Wed Jul 18 11:19:58 EDT 2001 | genny
I didn't wade thru all of the info you presented above, but your comment about ampacity of printed circuit boards brought to mind a copy of an article I keep in my files. Luckily I photocopied the whole page from the magazine and can actually tell y
Electronics Forum | Wed Mar 03 20:20:30 EST 1999 | Earl Moon
| We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 13
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
