Electronics Forum: copper substrate (Page 1 of 9)

Pits in copper on ceramic substrate

Electronics Forum | Thu Aug 12 00:17:15 EDT 1999 | DLKearns

Wanted to know if there was a good "to go by" tip other than the customers(if it helps current req.,10% of 30% of trace) requirements, about pits in the traces on copper plated ceramic substrates? More to the point how many is too many regardless of

copper land delamination

Electronics Forum | Mon Nov 15 14:40:38 EST 1999 | Bob Smith

Hi, I have a problem I've never seen before so I hope someone here can help. A recent batch of PCBs arrived where the copper lands delaminate with a small pull. Normally you have to pull pretty hard and the whole land comes off the substrate. These

Re: Relationship between BGA and PCB substrate

Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon

| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son

SMD ceramic cap size limit on metal substrate

Electronics Forum | Thu Nov 11 10:55:32 EST 1999 | KenF

Hi, could anyone tell me the maximum size of an SMD ceramic capacitor that can be assembled on a copper based substrate reliably? The SMD will be reflowed on the copper substrate. The main concern is the CTE mismatch between the ceramic capacitor and

Migration of copper during reflow process

Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb

Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m

adhesion of copper to solder mask

Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito

Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.

Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

Sample preparation

Electronics Forum | Wed Apr 13 17:19:44 EDT 2016 | davef

Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates [ http://www.boulder.nist.gov/div853/Publication%20files/NIST_Apex94_Siewert.pdf ]

0.031 pcb bowing -- solutions?

Electronics Forum | Mon Aug 27 11:11:16 EDT 2012 | rway

We have 1/2 dozens 0.031 pcbs that bow after going through the oven. We are looking for a solution to this problem to prevent bowing of the pcbs. As a result of the bowing, the pcbs, on occasion get caught in the oven, and more often have transfer

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