Electronics Forum: copper thickness (Page 20 of 32)

Fillet Tearing

Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph

Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D

Re: T sub g

Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon

| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han

Re: T sub g

Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach

| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H

Black pad analisys

Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick

Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th

Black color solder wetting after reflow

Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday

This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Routing feedrates for PCB�s

Electronics Forum | Sun Mar 18 20:48:23 EST 2001 | Doug Leaser

I�m doing some research in the field of routing, or cutting, PCB�s using a non-conventional method as compared to conventional routing machines. I need some accurate feedrates for routing certain PCB materials, as listed below, to compare data. Unf

BGA non wetting

Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22

Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp

Polyimide PCB card assembly

Electronics Forum | Wed Jun 02 09:21:34 EDT 1999 | Dan Burnikel

Hello all I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with Pol

Singulation Machine - any suggested model types?

Electronics Forum | Thu Apr 11 05:47:21 EDT 2002 | ianchan

Hi everyone, Does anyone have experience and applications knowledge, to help recommend a singulation machine? for depanelization process of a : 1) 0.65mm thickness PCBA, with 0603/0402 SMD, 2) with materials composition makeup of a 1.5oz copper,


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