Electronics Forum | Wed Jun 02 09:21:34 EDT 1999 | Dan Burnikel
Hello all I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with Pol
Electronics Forum | Thu Apr 11 05:47:21 EDT 2002 | ianchan
Hi everyone, Does anyone have experience and applications knowledge, to help recommend a singulation machine? for depanelization process of a : 1) 0.65mm thickness PCBA, with 0603/0402 SMD, 2) with materials composition makeup of a 1.5oz copper,
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Thu Mar 30 09:32:54 EST 2006 | russ
Not arguing dan, but are you positive that they are not copper? anyway, what is happening is as the parts sucks down onto the board from reflow the extra paste is notnecessarily sqeezed out but it has no place to go. So it will form this ball on th
Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef
It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite
Electronics Forum | Sat Feb 16 07:21:17 EST 2019 | SMTA-Joe
I am experiencing a "tarnishing" issue on PWB traces that may be causing problems with component reflow. The PWB traces are made to the following spec: SOLDER MASK OVER BARE COPPPER WITH SILVER IMMERSION PLATING PER IPC4553, PLATING TO BE 8-12 MIC
Electronics Forum | Mon Feb 18 09:25:20 EST 2019 | davef
It doesn't matter if the traces have solder or not. We're talking thermal cycles. RE IAg thickness: I believe the IAg is a self limiting process, similar to IAu. Your fab may be able to help a little, but I don't expect a substantial change. And if
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
Electronics Forum | Thu Apr 15 14:56:43 EDT 1999 | Dave F
| Can anyone suggest or identifiy standards which tabulate the following: | | Conductor width, cross sectional and area conductor thickness for PCB's carrying up to 70 Amps? | Barry: Check: 1 Printed Circuits Handbook (Clyde F. Coombs) 2 Microel
