Electronics Forum | Thu Jan 29 05:13:35 EST 2015 | neeraj_iiser
how to solder manganin 0.05mm manganin wire to a copper plate
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef
Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for
Electronics Forum | Tue Mar 14 12:56:07 EST 2006 | robhs
Q: Is anyone aware of any solderability issues that may exist when soldering beryllium copper parts (in this case spring contacts) to a PCB using standard Pb63/Sn37 solder paste/wire?
Electronics Forum | Thu May 18 03:15:32 EDT 2017 | wama
We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but r
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Tue Feb 28 10:18:35 EST 2006 | Steve Gregory
I just went through the same problem. We have an inductor that is made with a bundle of 30-strands of Litz wire that is vaccuum coated with varnish, and have the ends of the wire bundles tinned that we have to solder to SMT pads on the board. The ind
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
