Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Sat Jul 17 03:02:58 EDT 1999 | Jeff Sanchez
| | | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | | | What is it you're trying t
Electronics Forum | Mon May 26 08:02:11 EDT 2003 | davef
Resistance: Tables of wire gauge often provide a resistance measure of some kind for each gauge. That way we can estimate the resistance of any length of wire we might be interested in. Calculating trace resistance is only slightly more complicated.
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Mon Mar 05 07:53:28 EST 2018 | wolverine55
Hello All We have a Universal Model 6287A that is estimated to be about 25 years old. It has run fine for most of it's life but recently has stopped communicating with it's host computer, whenever any commands were attempted to be sent to the machine
Electronics Forum | Sat Jul 17 13:25:02 EDT 1999 | Scott
| | | | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | | | | | What is it you're tr
Electronics Forum | Wed Aug 09 16:30:43 EDT 2000 | MarkS
Has anyone had (successful) experience placing testpoint vias under BGAs? We already have conventional vias, but we're contemplating converting them into testpoints (probably by enlarging the bottom-side copper diameter to .036" and opening the bott
.png)
