Electronics Forum | Wed Jan 26 21:16:28 EST 2000 | Dave F
Mark: It sound like one or more of the following is happening: * Previous heat cycles (ie, reflow, reflow, wave) are degrading the surface protectant * Wire solder flux doesn't have enough stomp to burn through the corrosion. That poor ol' stuff
Electronics Forum | Mon Apr 22 00:02:39 EDT 2024 | poly
That was handy! I'd love to get a wiring diagram though, mostly because I'm worried that the reason that the machine is not working is because a bit is missing... I've taken a photo of the inside and there's a markings where it looks like a board use
Electronics Forum | Thu Sep 21 21:00:21 EDT 2000 | Dave F
Well, I'm going to assume you: * Have a nichel barrier between the copper on your board and the gold / solder solution * Use a lead / tin near euthectic solder If so, I pick "C" - It doesn't matter. When concerned about copper tin intermetallics, t
Electronics Forum | Sat Dec 21 13:03:52 EST 2002 | V.RAMANAND KINI
Hi to all, All of us are familiar with the conventional way of making PCB...I mean...photo tools/expose/develop/etch/plate etc., These involve lots of chemicals and the work place is toxic. I have a small PCB with just two curves (circuit tracks)and
Electronics Forum | Sat Feb 16 16:14:20 EST 2013 | ericrr
Have you done a post-mortem on the blown fuse? Assuming it is a glass fuse, if it is all black around the glass then replacing the fuse will be pointless. (the new fuse will just blow again, making a black mark or BLACKER mark all around the glass)
Electronics Forum | Wed Jul 14 09:26:55 EDT 1999 | Dave F
| | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick.
Electronics Forum | Wed Jul 14 19:09:54 EDT 1999 | JohnW
| | | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stic
Electronics Forum | Tue Sep 12 12:43:26 EDT 2017 | deanm
50) traces. The design will be tested for safety and a file will be created listing all the critical components such as transformers, relays, wiring, enclosure material, etc. On the manufacturing side, a manufacturing facility must be indicated in
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Tue Mar 20 15:59:15 EDT 2007 | blnorman
We use preprinted labels and laser coding. For PCB we laser mark with CO2 (NdYAG for the aluminum heat spreaders). We either have an epoxy legend to burn out or we burn the solder mask to expose the copper ground plane underneath. Laser is a much
