Electronics Forum | Thu Apr 01 20:07:06 EDT 2021 | smith88
Is there a standard that gives criteria for cracks in Ferrite Cores? I have reviewed Jstd-oo1 G and IPC 610 G and do not see a specific reference to Ferrites. Thanks for your help
Electronics Forum | Fri Apr 02 18:47:25 EDT 2021 | davef
IEC 63093-1:2020 - Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 1: General specification
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Mon May 18 11:50:23 EDT 1998 | Earl Moon
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Tue Mar 08 11:50:55 EST 2011 | pgoodyear
As a technician that does frequent board level repair / rework some issues have come to mind. I have been an electronics technician for almost 50 years. In that time I have seen the evolution of electronics from point to point wiring using vacuum
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon
| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
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