Electronics Forum | Mon Jan 04 15:07:27 EST 1999 | Tracy Hille
I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicke
Electronics Forum | Tue Aug 01 22:04:11 EDT 2006 | davef
Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed from the board. * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Flash point (~12*C TCC) of IPA is low enough that all ele
Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F
| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic
Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F
Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr
Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House
Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y
Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon
| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I
Electronics Forum | Fri Oct 05 09:15:23 EDT 2001 | Ben Bierlein
It is a PCB material that has a woven glass / epoxy internal core and glass veil surface. It is in between the paper materials (FR1,FR2 and CEM1) and FR-4 as far as strength and cost. It is available in HiCTI material for high power applications.
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon
| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma
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