Electronics Forum | Thu Mar 15 17:38:46 EDT 2012 | jorge_quijano
Hello guys, I need your thoughts on this PCB I have, it seems that It was damaged by hit or something, I think there is no big issue because damage is on the corners, but I'm not pretty sure if It could has some other hidden damages, It has few SMDs
Electronics Forum | Mon Dec 03 15:46:16 EST 2012 | bmario
Hi, Recently we have found a chip on a card having very small damage on the die corner. I would like to know if there are some industry standard criteria of acceptance available. If not, what would you recommend?
Electronics Forum | Fri Mar 16 10:04:41 EDT 2012 | davef
We'd repair a drop board like this. Here's what our old friend Jeff Ferry said is a published article ... When boards lose their edge: when the corner of a circuit board breaks or is damaged, the problem cannot be ignored by Jeff Ferry One of the m
Electronics Forum | Thu Feb 28 20:14:07 EST 2019 | rronaldreegan11
I have obervation that after migrate into thicker MBB bag, customer having mbb punchure at corner edge issue when shipping box is damaged at corner. There is no change of forwader or customer. Only different is thicker MBB with diffrent setting of va
Electronics Forum | Fri Apr 30 22:45:59 EDT 2004 | Bryan She
we can test the defects with multimeter after reflow ,before ICT.and if we replace this damaged parts with good ones.everthing is ok.I'm sure this part is damaged during reflow,but why not other 19 same parts of the 20 on each board?we attach a therm
Electronics Forum | Mon Feb 18 13:53:44 EST 2013 | cbeneat
We have some Vectorguard stencils and frames. I am having issues with one of the frames. And need a little guidance. A stencil is on the frame, and we can't get it off, the operator heard a pop while putting the stencil on the frame, now we hear a
Electronics Forum | Thu Sep 15 09:31:02 EDT 2016 | ladmo1
While removing one part, another part - BGA part - several components away, actually melted on one corner - you can see the plastic body of the part oozing out around one corner between the solder balls. Several of the solder balls on the one corner
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Electronics Forum | Tue Oct 18 15:50:01 EDT 2022 | smith88
IPC states chips and cracks in glass body are defective if beyond specifications. Chips or cracks in glass body beyond the part specification, see Figure 9-18. • Cracked or damaged glass bead beyond part specification (not shown). On some glass
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