Electronics Forum | Thu Jul 02 16:01:57 EDT 2009 | ewchong
thanks kpm. agree the cause of those pads lifting. all of them were no connects so they cannot be the cause of the electrical failure. when the bga was removed, all the solder balls on the pcb turned into conical shape due to the separation, except
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Electronics Forum | Tue Nov 03 01:54:04 EST 2009 | vinitverma
Hi, We already export in plain ASCII format with the PCB dimensions, coordinates of all 4 corners with respect to the origin, circuit repeat offsets, and Centroid data with RefDes, X, Y, R, Part No. and Package information. However many customers ha
Electronics Forum | Sat Mar 06 17:45:29 EST 2010 | isd_jwendell
Unfortunately, what you are calling a good fillet is not a good fillet. Solder on the top of the IC lead does not help to make a good connection. The most important fillet is the one located at the heel (think of the IC lead where it meets the PCB as
Electronics Forum | Fri Mar 26 21:48:56 EDT 2010 | dman97
Can someone explain to me what I'm supposed to do after I have done the vision offset calibration procedure? The manual tells me to put solder paste down on all 25 holes of the stencil. After this the board drops down and the machine scans each fidu
Electronics Forum | Thu Apr 07 09:26:03 EDT 2011 | alcatel
Im trying to get the XY data to program the SMT machines. since i dont have the file, im trying to convert it from the gerber drawing. the closest one to represent the component placement is the solder pad. ive tried using linkcad to convert it to XY
Electronics Forum | Mon Aug 29 13:43:58 EDT 2011 | jax
Enlarging the "End Pads" is normally done to help accomodate the Wave soldering process... works as solder thief to help eliminate bridging on the last 2 pins to cross the wave. It is reasonable to assume that, if you are seeing cold solder due to fl
Electronics Forum | Mon Aug 29 21:36:39 EDT 2011 | davef
We agree with JAX. Changing the pads on your board as you describe won't do shit. Possible solutions to a cold solder connection problem include: * Raise the peak temperature to be high enough to reflow the material thoroughly. * Select a solder pas
Electronics Forum | Tue Mar 19 07:04:21 EDT 2013 | Flux Capacitor
When I enter in the program data for a particular PCB on our Juki, I choose a board fiducial and enter its X Y location as the "bad mark position". (Although I'm not sure if your model refers to this as a "bad mark" as well.) Place a sticker over tha
