Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Tue Feb 22 09:01:50 EST 2005 | davef
It could be that you're starting with hyper corroded nickel, before you even begin work. With electroless nickel, everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive [during fabrication]. Immersion gold
Electronics Forum | Thu May 28 22:17:18 EDT 2009 | davef
If your fabricator understands and controls their in-house ENIG, you should be OK. It seems that fabs don't undererstand ENIG processes well enough to duplicate hyper-corroded nickel, but those that have not seen the defect usually never see it.
Electronics Forum | Mon Jan 04 22:09:57 EST 2016 | a290668789
It's amazing. I rarely saw that ENIG finish could be corroded. It should be the Nickel corroded issue and then affected the solderability. Not clear how to clear this, if you get the answer, let me know. good luck
Electronics Forum | Wed Oct 29 07:21:59 EDT 2008 | davef
During soldering, the gold dissolves into the solder connection. You solder to the nickel. The gold protects the nickel from oxidation. Corroded nickel is very difficult to solder. So if your gold is thin, it may not protect the nickel from corrosion
Electronics Forum | Thu Jun 17 07:04:03 EDT 2004 | davef
It sounds like the parts are not soldering properly [have poor solderability]. This probably due to corroded nickel underplate caused by: * Nickel that oxidized, while awaiting overplating * Poor quality tin overplate, allowing nickel to oxidize aft
Electronics Forum | Mon Feb 14 12:19:32 EST 2000 | Dave F
Dean: I associate black plague as an immersion gold process problem (although I could easily be wrong): Everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive. The immersion gold works by corroding the nic
Electronics Forum | Thu May 18 20:42:36 EDT 2006 | davef
Hypothesis #1: We agree with Steve. You are probably seeing the nickel underplate. The gold was absorbed into the solder in portions of a second, so that you don't see it is not surprising. We're guessing that the gold was porous and allowed the n
Electronics Forum | Tue Jul 08 20:47:38 EDT 2003 | davef
Sam: If your gold overcoat was pourous, the nickel undercoat would corrode prior to your attempting to solder and you would not be able to solder without an aggressive flux. Since you see solder flow and wetting, it indicates the gold did an adequat
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
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