Electronics Forum | Thu May 23 03:10:43 EDT 2002 | ianchan
Hi mates, need your advise here. we have solderballs on a model due to neglect by stubborn folks to follow issued process control instructions. the post-reflow PCBA has solderballs stuck in the NC flux residue and is not in compliance to IPC-A-610
Electronics Forum | Sun Sep 22 09:36:04 EDT 2002 | davef
Sometimes the cut end of QFP leads have corrosion that is very difficult to solder. If this is what you're talking about, it is not a defect according A-610C, 6.5.2, Exposed Basis Metal
Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F
Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce
Electronics Forum | Fri Jun 01 10:52:37 EDT 2012 | blnorman
Neither the Omega meter nor the IC are officially "destructive" tests, but everywhere I worked we treated them that way. The boards were scrapped after the test. The Omega meter can be tested at elevated temps, but the IC sample is extracted at ele
Electronics Forum | Thu Jan 27 08:52:05 EST 2000 | Todd A. Braun
We currently use a silicon conformal coating on many of our manufactured circuit boards and are experiencing situations where the coating doesn't conform. For example, on the sharp edges of components and corners of leads it pulls away before curing
Electronics Forum | Tue Nov 04 19:34:27 EST 2003 | gregoryyork
Blimey that's a problem and a half. Water Solubles will look completely different residue wise than No Cleans, pending age and solids contents No Cleans will go white powdery - watersolubles will stay oily Alternatively process reworked PCB's through
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
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