Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Tue May 08 11:27:49 EDT 2001 | Eyal Duzy
I will review some of the advantages/disadvantages of AOI vs. X-Ray one by one according to the main differences that you may find between them. * AOI uses optics that can "see" only visible elements. X-Ray can "see" hidden elements. There is a ve
Electronics Forum | Tue Jan 03 15:16:53 EST 2006 | Cmiller
In circuit testing is expensive up front because of the fixture cost but the tests are fast. AOI programs can be develpoed in less than a day but take longer to run. If you have good test coverage, in circuit would be a better choice in my opinion-if
Electronics Forum | Tue Jan 25 21:29:24 EST 2011 | rway
I understand what you are asking. I just wanted to ask if you or your company has considered purchasing an AOI or ICT? Perhaps both? Both are valuable tools in the manufacturing process. We lived without our AOIs for quite some time, but in my ca
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Electronics Forum | Mon Aug 27 08:58:24 EDT 2012 | rway
Reese, > > We would agree about the value of an > ICT system, in a general manufacturing > environment. However, a couple of notes > apply: > > 1. ICT isn't a catch-all, either, and > should be used to verify the process, not > validate it.
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny
We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som
Electronics Forum | Thu May 10 13:10:25 EDT 2001 | orbotech
A configuration of a number of AOI tools located at different inspection stages along the SMT production line has, by its nature, the ability to provide a faster and closer response to possible process related fault occurrences. Comparing with today
Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
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