Electronics Forum | Tue Jun 03 12:24:50 EDT 2003 | blnorman
I have received information from the European Commissioners Environmental group that automotive electronics are not covered by WEEE (waste electrical and electronic equipment 2002/96/EC) or RoHS (reduction of hazardous substances 2002/95/EC) because
Electronics Forum | Thu Jun 05 16:44:19 EDT 2003 | blnorman
The data we have is from an IBM report. Below 100�C the SAC reliability is almost double that of SnPb (-40 to 100�C thermal cycle). When the upper end temp is increased to 125�C the reliability drops to 75% of SnPb. I'd like to see the data that s
Electronics Forum | Tue Jun 03 18:34:22 EDT 2003 | Kris
Hi, There have been other studies where it was found that lead-free soloder joints are more reliable than tin-lead solder joints irrespective of test conditions. In fact the automotive industry has been using Sn/Ag for underhood applications for a
Electronics Forum | Thu May 11 16:48:57 EDT 2006 | patrickbruneel
In all fairness no one has the answer for you, non of the lead-free alloys has been long enough in use or have supporting long-term reliability data. No matter what alloy you will use, your company will be at risk, that�s why so many exemptions are a
Electronics Forum | Thu May 11 08:27:15 EDT 2006 | timnop
We will be receiving our lead free wave solder machine soon and I have been doing a lot of reading here. I've seen many dicussions about SAC vs. SN100C for wave applications and am leaning heavily towards the SN100C for my process. I haven't seen any
Electronics Forum | Tue Dec 21 11:49:33 EST 2010 | remullis
1st the buyer shouldn't control the process based on cost. Let them buy stuff and stick to that. 2nd, I do think leveling in th HASL process is important. If you have high spots on pads for fine pitch your wiping away more of that aperture than othe
Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39
When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Thu Apr 15 20:55:36 EDT 2004 | Ken
Try: Tungsten, tungsten carbide, ceramics like boron-nitride or how about pyrex glass? Glass blowers could make "hooks" that connect to a cross bar. I would NOT use aluminum (even if anodized). Try stainless steel 316. 303, 304 do not have enough
Electronics Forum | Fri Nov 19 08:03:18 EST 2010 | theo
Can anybody tell me what kind of anti-seize compound to use in a lead free solder pot? I have found copper, nickel, and silver anti-seize but I cannot decide which one to use. Thanks for the help.
