Electronics Forum | Thu Jun 15 16:28:48 EDT 2017 | davef
You should be searching on RN Wild, not Roger Wild This might be a good starting point https://supplychain.gsfc.nasa.gov/docs/sc2011j.planteb.pacquetteasof1020.pdf
Electronics Forum | Thu Jun 15 14:14:18 EDT 2017 | pfuhrman
I have seen a few references in this forum to an old study (1980s?) by Roger Wild at IBM. But I cannot find a published report or usable reference to one. davef mentioned the SMTnet archives as a possible source, but that has also been a dead end.
Electronics Forum | Fri Sep 20 16:25:47 EDT 2002 | bdoyle
ok time for a "what if" What if someone came back a year after a question was posted. The question dealt with a problem that this person had but didn't exactly cover everything. Would it be better for this person to post a new thread (and then mig
Electronics Forum | Fri Oct 26 09:38:57 EDT 2007 | slthomas
Rather than go into detail here, try googling "classic reflow profiling". One of the guys at ECD (a thermal profiler manufacturer) wrote a pretty decent article that covers most if not all of it. You DO have a profiler, don't you, or an oven with
Electronics Forum | Thu May 11 12:44:04 EDT 2006 | slthomas
One of our customers' products has a couple of adjacent 0603 packages (one resistor, one cap) that are .010" apart. They are side by side, not end to end. The adjacent pads between the two parts are electrically connected so bridging isn't an issu
Electronics Forum | Wed Jan 14 12:40:46 EST 2015 | dyoungquist
MSL is used for components (and possibly bare pcbs) that are going to go through a reflow oven process in the future. In most cases, populated pcb assemblies will not be going through the reflow oven process again. Therefore, it is not necessary to
Electronics Forum | Mon Mar 16 10:44:29 EST 1998 | Jim Gustin
Maybe I'm doing something wrong, but it seems to me that The Forum takes a lot longer to open up now. It also takes a lot longer to get back to the main Forum page, after reading an individual message, and hitting the "BACK" button. What's up? Is th
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Tue Jan 13 15:48:58 EST 2015 | natashakt
170 degrees Celsius) and regular FR4 materials. I am trying to see if we can use table 5 on page 14, "Recommended Equivalent Total Floor Life (Days)" to find out how long (at specific humidity and temperature) our populated and unpopulated PCB's can
Electronics Forum | Fri Apr 16 17:19:59 EDT 1999 | Dave F
| | Hi, | | I just cheesed my previous attempt at this. I looked through IPC 600 and couldn't find anything relating to dimensional stability of a board with regard to stretch. I found bow and twist but nothing on size. I have a PCB that is .030"
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