Electronics Forum: cp40cv array setup (Page 1 of 2)

X outs

Electronics Forum | Thu Jul 25 14:05:12 EDT 2002 | Bordiky

I've been reading the forum here for a few weeks and found some helpful material from talented individuals. Now, I have a question(s). I'm looking into different alternatives for doing X outs. Right now I'm familiar w/ two of them:1. Bad Board Mar

Stencil Printer comparison

Electronics Forum | Sat Nov 23 11:16:05 EST 2002 | mark

Transition Automation is offering a unique offline tooling system, which definetely improves the mpm machines compared to dek. Considering the big cost gap between used mpm and dek machines, if you buy mpm, and buy transitions instant fixture upgrad

Re: Resistor Paks on solder side of board

Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000

These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between

Voids in solder fillet

Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef

Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica

How to place pin supports the same everytime a board is ran?

Electronics Forum | Tue May 22 10:33:36 EDT 2012 | swag

In my opinion, the best solution is h-towers or similar dedicated tooling designed for each build. However, a quick cheap fix is to make templates to lay in the bottom of the centernest. If you have access to CAD software, you can print out the ger

Mechanical Delamination at de-panel

Electronics Forum | Mon Jun 02 15:03:05 EDT 2014 | clydestrum

Background on the PCB: Thickness: .032" Material: Standard Fr4 V-score: Leaves .016" (approx .008" cuts on either side) We are having some issues on these boards where the edges are delaminating all the way to the copper during de-panel. Now, we are

AOI vs. XRay

Electronics Forum | Tue May 08 11:27:49 EDT 2001 | Eyal Duzy

I will review some of the advantages/disadvantages of AOI vs. X-Ray one by one according to the main differences that you may find between them. * AOI uses optics that can "see" only visible elements. X-Ray can "see" hidden elements. There is a ve

Mechanical Delamination at de-panel

Electronics Forum | Wed Jun 04 18:46:10 EDT 2014 | hegemon

Well, we cannot make the cuts any deeper as then > we would incur a significant amount of "bowing" > at SMT placement/reflow. Interesting. Could be a number of factors contributing. Here's a story.... In the beginning was the board design, and in

Faster Than Lightning!

Electronics Forum | Mon May 13 03:08:23 EDT 2019 | reckless

Thank you for your response. I'm new to SMT so I am constantly learning. Unfortunately have not come across books that go in detail about these issues (if I ever get time I might write one). I have an older universal gi-14d (7 spindle head, dual g

Re: product changeovers

Electronics Forum | Sat Jul 03 01:09:29 EDT 1999 | DEAN

| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan

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