Electronics Forum | Tue Jul 03 09:57:25 EDT 2001 | johnw
Hi guys I am looking for any info on cpk values IE fcp6, fip2,fip3 What are the variables to consider for placement times and part sizes. Cheers
Electronics Forum | Tue Jul 17 19:35:38 EDT 2001 | Anonymous
John, You realize the DT-651 machine from Fuji will allow you to do CP and CPk data as well as calibrate your feeders. Something to think about.
Electronics Forum | Wed Jul 04 14:59:29 EDT 2001 | johnw
Dave thanks for the info
Electronics Forum | Wed Jul 04 12:22:07 EDT 2001 | davef
Several points: * Consider that your Cpk is probably different for both placing large and small components. * Probably your routine placement rate SB the speed you use to monitor the accuracy of your process. * Some people use a calibrated glass test
Electronics Forum | Thu Nov 07 06:10:13 EST 2002 | stefwitt
I used once flux cream on a glass plate for a customer application, which should simulate almost the same cohesion than solder paste.
Electronics Forum | Thu Nov 07 01:47:37 EST 2002 | Bach Huss
Hi all, I plan to measure the placement repeatability and accuracy. Is there any work done to simulate the paste effects on test board without using paste (My measurement equipment is a back lighting equipment). I saw someone placing components on
Electronics Forum | Thu Nov 07 20:46:00 EST 2002 | davef
Most of the printer and dispenser equipment companies job-out this glass plate analysis for the factory, pre-shipment verification of the capability of their equipment. Check with your equipment supplier, find-out the company they use [If they do it
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000
These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between
Electronics Forum | Tue Aug 23 07:59:53 EDT 2005 | avalancher
That's an interesting fact Ken. Now I think i've seen every figure out there. Let's see, CPH, DPMO, CPK, and now, hmm, what would this be called, PPPSF (parts placed per square foot). Does anyone have a formula on this to figure out my PPPSF?
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