Electronics Forum | Thu Mar 27 07:56:04 EDT 2014 | rrosera
My company is researching the use of re-workable underfill for use on our avionics boards. We are currently testing Hysol UF3810. The Rework machine we use has a vacuum based removal system witch isn't strong enough to overcome the underfill. We have
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Wed Nov 08 05:19:28 EST 2006 | amigo
It's not underfill is it? Sorry, but i don't know what is underfill, if you mean BGA, yes it is BGA !also sorry for very very late reply
Electronics Forum | Mon Sep 28 09:23:03 EDT 2015 | slave2anubis
Hi, sorry for reopening a old thread, but i wanted to ask if there is a way to know at what temperature the solder melts if you have a chip with underfill? I thnk its lower then normal air-fill temperature since the underfill conducts heat better the
Electronics Forum | Mon Jun 06 07:14:21 EDT 2005 | pci
We find it impossible to remove the glued chips > like the CPU and the UEm ICs in Nokia Mobile > Phones. They are both surface mount devices and > glued with some chemicals we think. Any help is > most needed in this matter. May we know what pr
Electronics Forum | Mon Jun 06 04:36:44 EDT 2005 | rlackey
It's not underfill is it?
Electronics Forum | Fri Mar 28 10:11:31 EDT 2014 | davef
hege: beer can opener!!! The ultimate multipurpose tool ... BR davef
Electronics Forum | Fri Mar 28 16:27:43 EDT 2014 | hegemon
Lol Dave. Give me a lever long enough....
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