Electronics Forum: cpu underfill remove (Page 5 of 6)

Re: "Superboy" needs HELP

Electronics Forum | Wed Jun 24 21:32:07 EDT 1998 | Jon Medernach

Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip Chi

Re: "Superboy" needs HELP

Electronics Forum | Thu Jun 25 08:24:13 EDT 1998 | Earl Moon

| Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip C

Re: "Superboy" needs HELP

Electronics Forum | Thu Jun 25 09:08:14 EDT 1998 | Russ Miculich

Thought I'd jump in as I helped develop materials for the FC game. Au/Pb - bumping - talk to Hughes Tuscon about this. They do it and will discuss the process. For Flip Chip Technology here in the States - contact Peter Elenius at Flip Chip Techno

Re: Warning! Somebody is sending virus files!

Electronics Forum | Mon Mar 15 01:09:45 EST 1999 | P.L. Sorenson - Technical Consultant

>>Date: Fri, 12 Mar 1999 12:09:57 +1000 >>>From: Paul Hardaker >>>Subject: [h-all] WARNING: Win32/Ska.A (Happy99) Worm >>>Sender: owner-h-all@ob1.uws.edu.au >>> >>>A relatively new, and quite serious "virus" (really a Worm or >>>Trojan Horse) called

Mis-alignment Headaches

Electronics Forum | Tue Jul 11 23:28:59 EDT 2006 | donb

Hi All, I have a continuing problem here with mis-alignment of parts on one of our Fuji CP-3 machines and I thought one of you esteemed engineering types may be able to give me a clue as to where the problem might lie. I have a Fuji trained enginee

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef

Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially

CP42 Camera Problem

Electronics Forum | Mon Mar 03 12:25:37 EST 2008 | daxman

The problem was first noticed while doing a nozzle center. The wide angle camera would not display an image. After rebooting the machine (sometimes it took several tries) the camera would work. A few months later, the wide camera would not boot at a

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 04:42:52 EDT 1999 | Brian

Dave, I'll respond by paragraph: | | | Brian: | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake burritos through

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 12:27:21 EDT 1999 | Earl Moon

| | | Dave, I'll respond by paragraph: | | | | | Brian: | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef

His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could


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