Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Electronics Forum | Fri Jun 25 09:18:23 EDT 2010 | flipit
Thanks, Dennis. That is a good idea, but I > have problem :) - our logistic department lookig > for cheap components...What other mnfg of cap you > use? Regards, The capacitor dielectric material might be something you could look at also. COG,
Electronics Forum | Fri Jul 09 19:09:52 EDT 2010 | rway
A couple of things: Does the cap break if you try to remove it with hot air? If not, than you are breaking the caps do to mechanical stress. We have had similar issues. I don't think your board is suffering from mechanical stress from depaneling o
Electronics Forum | Sat Jun 19 08:32:49 EDT 2010 | davef
Please describe the location and appearance of the crack
Electronics Forum | Mon Jun 21 02:15:03 EDT 2010 | ppcbs
We also encountered the crack case in multi layer Ceramic Cap,0603 after touch up. Most failure were on the terminals. Previously, we used 0805 instead 0603.that time, failure were very few.
Electronics Forum | Mon Jun 21 12:02:36 EDT 2010 | roland_grenier
check your de-panelling process if you are using break-out tabs or V scoring.
Electronics Forum | Sun Jun 27 22:25:51 EDT 2010 | leadthree
*** silly question deleted, there are no 100nF NPO ***
Electronics Forum | Tue Jul 06 12:06:32 EDT 2010 | baildl632
Is the board a two sided smt board? If so, where are the standoffs (board supports) located during the second side run? The 0805 being thicker than the 0603 may explain why 0805 was cracked less.
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
winsouce.jpg)
