Electronics Forum | Mon Mar 08 11:54:06 EST 2004 | Wayne Smith
Currently experiencing a problem where the plastic molded bodies of tantalum capacitors are cracking during my SMT processing. Caught after our conformal coating process. I don't know where in the process they cracked. Currently running an exper
Electronics Forum | Fri Jul 12 22:15:56 EDT 2013 | ericrr
Sorry to build up your hopes. The latest thing to hit the air ways at work, I was accessed of fiddling with the oven settings, because there were reports of "cracked joints" there was no mention of where the cracks were, cracked at the pcb or cracke
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar
Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol
Electronics Forum | Tue Nov 01 09:57:18 EST 2005 | Chris
Hi, I am experiencing cracked solder joints on ceramic resonators after the ultrasonic plastic weld process. PCB assy is placed into plastic housing and then housing halves are ultrasonic welded. Not a soldering problem. I know this component is
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Thu Feb 03 10:01:08 EST 2005 | Philj
Try heating a blank board on a hotplate to 183 deg C. with a board this thick, if the layer construction is poorly balanced, it may bend enough in the region of the ceramic capacitor for the soldered joints to crack it on cooling to ambient.
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Wed Aug 24 12:37:38 EDT 2011 | hussman
Hello all, We just got some board back from thermal shock and we found that several of the 2512 resistors opened up. Actaully the solder joint cracked away from the board. All other coponents look great. Boards were good before test. 10 layer bo
