Electronics Forum | Tue Feb 07 13:01:52 EST 2006 | amol_kane
Hi, does anyone have any experience with common wave soldering defects using SAC305 alloy?.....i am finding a lot of what seem to be shrinkage cracks on the bottom side surface of the soldered components.....there is also a lot of directional cooling
Electronics Forum | Wed Dec 04 07:39:11 EST 2019 | proceng1
I still don't see the defect, but in general, yes you can use an iron to reflow and cracked or suspect joint. You may want to add a little flux before you apply the iron.
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Wed Sep 07 09:55:21 EDT 2005 | Slaine
not keen on pressing myself lot of stress can lead to delam and cracked solder joints, I prefair CNC router, lot of dust but if its extracted well its very good and stress free in more ways than one
Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Electronics Forum | Wed Mar 17 02:14:39 EST 1999 | Joe
| | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of
Electronics Forum | Mon Jul 07 00:11:10 EDT 2003 | praveen
if the capacitors are placed very near to the edge and their position is 90 deg than it may cause crack.4thly if the reflow ramp rate is more than 3 deg C then it may crack. 5th ly if the solderin tip temp. is very high and soldering bit is very thi
Electronics Forum | Mon Aug 11 10:35:32 EDT 2008 | realchunks
What does your top side wetting look like? This is a perfect case where top side wetting will tell you when you have a good joint. Without seeingor knowing your process, I would suggest either more pre-heat or longer dwell in the solder. Either on
Electronics Forum | Sat Oct 08 11:57:58 EDT 2016 | davef
A friend in the contract coating business said: "... ask why the wire is [teflon] coated in the first place, as only the solder joints should be coated in this situation as the flexing/bending of the wires will cause the coating to crack and flake of
Electronics Forum | Thu Aug 18 09:41:05 EDT 2016 | jbuckley
Typically on my company's Mirtec systems, any anomalies, such as cracks, chips, etc. on chip capacitors and chip resistors are going to be detected with just a basic mounting inspector. We have a full image of the part (solder joint not included) as
