Electronics Forum | Wed May 31 13:23:48 EDT 2006 | slthomas
You don't say anything about the appearance of the solder joints themselves. That would go a long ways towards identifying and possibly resolving your issues. Heating and cooling could affect performance if you have a/some cracked or otherwise loose
Electronics Forum | Wed Mar 17 19:00:14 EST 1999 | Earl Moon
| | | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot o
Electronics Forum | Sun Sep 09 22:57:05 EDT 2007 | syedsmt
Dear Members, Sorry,I might have not made myself clear on this issue and creating some confusion.Actually the problem faced is during the DIP Soldering process whereby one of the connector(IDE Pin) solder is cracked and lifted from the pattern.Visual
Electronics Forum | Wed Sep 09 10:02:46 EDT 1998 | Earl Moon
| | | I am in need of possible causes and solutions to capacitors that are failing in the field. | | | Are there issues in our process that need to be | | | checked? | | | Some people said the problems are due to improper | | | storage. Others sa
Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Mon Aug 10 12:58:04 EDT 2020 | SMTA-64386637
We have found Acrylic CC under QFNs is a failure mechanism in thermal cycling. The coating acts as a wedge and causes solder joint cracks. We do not coat QFNs. To enhance reliability we have the vias plugged with solder mask. This eliminates some
Electronics Forum | Wed Apr 14 10:24:17 EDT 2010 | fönsi
Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer fo
Electronics Forum | Tue Dec 15 02:00:32 EST 2015 | padawanlinuxero
We do what here is call a master, this board has a bunch of misalign components, missing components, bad solder joints, crack components, and other defects that we want the AOI to look for, now we compare what the AOI finds with a list of the defects
Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas
You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on
