Electronics Forum | Fri Oct 15 11:32:04 EDT 2010 | patrickbruneel
Inspecting for plating problems shouldn’t be part of incoming inspection. Your board manufacturer should have the appropriate process control. I shouldn’t have said barrel cracks but plating skips. Plating skips are caused by dull drills or a too hi
Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey
| | I am in need of possible causes and solutions to capacitors that are failing in the field. | | Are there issues in our process that need to be | | checked? | | Some people said the problems are due to improper | | storage. Others say it is th
Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara
Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when
Electronics Forum | Wed Apr 23 21:34:24 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Tue Aug 31 20:41:45 EDT 1999 | Dreamsniper
| | I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average r
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Wed Nov 14 01:00:20 EST 2007 | reypal
recently, we also have problem with QFN around 3% defect related to soldering. from the cross section it turns out to be solder crack. it could be the paste volume on the center pad is too much causing QFN to float that eventually will cause crack on
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Fri Apr 08 05:10:10 EDT 2005 | siverts
What is Your customers requirements? Is the PCBA mounted with front/back connectors? Will the PCBA be mounded in a rack and connected to opposite connectors on the other side? In this case, if the warpage is more than approx 1-1.5 % You will then n
