Electronics Forum: crack solder joints (Page 11 of 323)

Blow holes on radial parts solder joints

Electronics Forum | Fri Apr 06 07:32:54 EDT 2001 | Claude_Couture

Thanks for the tips. I'll have to check with the designers if they can accomodate the height if I was to use parts with stand-off. The bigger holes was already suggested, but they don't want to change them until a new revision on the product comes o

Poor solder joints on QFP 100's

Electronics Forum | Sat Dec 11 12:15:21 EST 1999 | Steve Thomas

We have a pretty challenging board (2-up panel, 15"x20", 48 20mil pitch QFP 100's and 2 25mil QFP128) that gives us LOTS of lead bridging on the 20 mil parts. There is typically very poor wetting on these parts also, and some joints just flat aren't

wrinkles solder joints after double reflow

Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel

The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching

Blow holes on radial parts solder joints

Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton

We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Blow holes on radial parts solder joints

Electronics Forum | Fri Apr 06 16:19:12 EDT 2001 | davef

We build a mixed tech [eg, QFP, SMT fly shit, DIP] board where we can't clinch the DIP. So we set the clinch and cut on the DIP to just barely clinch, leaving the leads very perpendicular to the board. I wonder if you could do something similar wit

Re: Thermal fatigue of solder joints

Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho

HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of

Re: orange peel effect on solder joints

Electronics Forum | Thu Jul 20 17:10:11 EDT 2000 | Darby

It's six in the morning here! Give me a bell the next time you are out here and I'll take you fishing on the sensational Sydney Harbour. However I will not be getting out of the boat and "diving" - too many noahs arks. I'll leave that to the daredevi

wrinkles solder joints after double reflow

Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov

Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w

Blow holes on radial parts solder joints

Electronics Forum | Thu Apr 05 22:27:06 EDT 2001 | davef

As a band-aid, consider running your chip wave when soldering these boards [Similar to Cals "dance with me babe" suggestion.] If the problem is as broad based as you say and the radial components have a tight fit, consider increasing the holes by a


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