Electronics Forum | Mon Aug 01 20:02:20 EDT 2005 | Joseph
We use SAC305 and top side particular joint temp. is 110 deg C, and the terminal finish for that particular lead is pure tin. It look like hot tearing at the primary side of PTH.
Electronics Forum | Mon Aug 01 06:59:02 EDT 2005 | Joseph
Dear all, We observed visible micro crack at top side of solder fillet during lead free wave solder process. We did not see any visible micro crack at bottom side, and it always located at joints of transformer. Any input be much appreciated. Best
Electronics Forum | Wed Aug 03 21:29:59 EDT 2005 | Ken
Yes, lead can promote fillet lift. In order to understand this defect you must begin looking at your lead frame mateials. some lead frames are more susceptable to this disorder. This is most likely a cte mismatch disorder. Lead contamination in
Electronics Forum | Sat Feb 02 09:33:33 EST 2002 | davef
�8.4.2, Cracking Of Soldered Joints in the epic "Soldering In Electronics" by RJ Klein Wassink [Electrochemical Publications,ISBN 0 901150 24 X] covers cracking differented by: * Overloading * Creep * Fatigue You can't go wrong by starting there.
Electronics Forum | Fri Feb 01 14:23:47 EST 2002 | delnosa
Looking for help on getting information on understanding the physics of micro-fracture growth rate within the BGA ball (or solder joints in general). Hoping to find a fairly straight forward study on the concept/theory of this topic. I'm not a meta
Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai
I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T
Electronics Forum | Fri Feb 22 15:16:24 EST 2002 | rkevin
Bet your using tin/ lead plated components with a lead free Cu/Ag/Sn alloy. It leads to intermetallic cracking. Wow didn't anyone tell you to check the archives yet, It seems to be the answer given to everyone. Why have an interactive site if you alw
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis
I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin
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