Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Wed Jan 15 10:31:55 EST 2020 | emeto
Having 10c thermal differential is a lot. Trying different paste might help - usually thermal expansion makes component detach from PCB, then joint is formed and solidified, then component goes back but is too late to form a joint. Cooling speed migh
Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020
Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur
Electronics Forum | Mon Jan 13 17:39:49 EST 2020 | avillaro2020
Hi, I need help on how to address the solder wicking on the samtec searay connector after reflow resulting to open solder joints on thick and thermal heavy PCB (4.4mm and 6.3mm). I increased my solder paste thickness to 8 mils, the connector is manua
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Tue Jan 14 17:22:16 EST 2020 | emeto
Avillaro, would you say that vapor phase process was selected, because the boards are so thick and heavy? I would assume so. Have you ever tried to run them through reflow oven? To understand better your challenge, we need to understand the setup be
Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020
Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay
Electronics Forum | Tue Jan 14 10:48:07 EST 2020 | dontfeedphils
I've worked with these quite a bit in the past as well. As the previous poster mentioned, we ran either 4/5 mil thick stencil with a pretty standard RTS profile in a 10 zone convention oven without issue.
Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020
Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more
