Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Thu Apr 01 10:49:14 EST 1999 | AF Ng
| Has anyone heard of a problem with catastrophic failure of | large value (200uF) solid tantulum capacitors that have been | exsposed to high humdity. | I suppose that with water moisture seep in the capacitor, the risk is very high that abrupt o
Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Electronics Forum | Fri Apr 02 02:01:24 EST 1999 | P.L. Sorenson - Technical Consultant
| | | Has anyone heard of a problem with catastrophic failure of | | | large value (200uF) solid tantulum capacitors that have been | | | exsposed to high humdity. | | | | | I suppose that with water moisture seep in the capacitor, the risk is ver
Electronics Forum | Thu Apr 12 20:27:10 EDT 2001 | davef
Tantalum caps degrade over time. You should not be seeing "chipped-off & cracks" regardless of the age. This should not be a shelf-life issue, unless you are storing them in an aquarium. Tell us the story. Solderability is a shelf-life issue and
Electronics Forum | Mon Mar 08 11:54:06 EST 2004 | Wayne Smith
Currently experiencing a problem where the plastic molded bodies of tantalum capacitors are cracking during my SMT processing. Caught after our conformal coating process. I don't know where in the process they cracked. Currently running an exper
Electronics Forum | Mon Mar 08 20:22:05 EST 2004 | davef
Wayne: Please describe the location and angle and direction of the crack relative to the board.
Electronics Forum | Mon Mar 08 21:50:16 EST 2004 | John Soileau
I expierenced this while at I-PAC Manuf. when the reflow profile was too hot in the perheat & soak zones.
Electronics Forum | Mon Mar 08 19:44:37 EST 2004 | Ken
I vote furnace is causing popcorn affect. Seen this many times over the last 4 years....especially if your buyers are buying parts on the "grey" market. Unless your running mechanical cenering machines (GOD I miss the Dynapert days)it's probably st
Electronics Forum | Mon Mar 08 15:37:41 EST 2004 | pdeuel
What type of P&P machine? Useing any Placement force? Ramp speed in reflow? PCB thickness properly defined? Tooling supports too high? Any doubble stacking of parts? Occuring with only one part manufacturer? Start with processes where problem is note
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