Electronics Forum | Fri Jul 12 22:15:56 EDT 2013 | ericrr
Sorry to build up your hopes. The latest thing to hit the air ways at work, I was accessed of fiddling with the oven settings, because there were reports of "cracked joints" there was no mention of where the cracks were, cracked at the pcb or cracke
Electronics Forum | Tue Oct 30 10:54:37 EST 2001 | slthomas
Hey, Preacher, choir here. Unfortunately I didn't get to make the call here (hot boards, new product, same ol' same ol'), but I dam* well am looking for future (print) backup to assist in persuading the bottom line guys that it's cheaper to wait for
Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
Electronics Forum | Mon Jul 15 08:11:04 EDT 2013 | emeto
I am pretty sure that is a moisture issue. You should probably bake your boards and some of your parts.
Electronics Forum | Thu Jul 18 04:42:32 EDT 2013 | ericrr
Thanks for that, sorry Im late setting (set by someone else) Speedline Bravo Top 1st chamber, 2nd, 3rd, 4th. 170° (c), 180°, 190°, 270°. Bottom 170°, 180°, 180°, 260° chain speed 27cm/second.
Electronics Forum | Fri May 31 05:54:09 EDT 2019 | dhanish
What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.
Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare
See also ... https://www.semlab.com/solder-joint-failure-modes/
Electronics Forum | Sat Jun 01 04:22:24 EDT 2019 | gregoryyork
Depends on lead free alloy choice as well
Electronics Forum | Fri May 31 10:15:30 EDT 2019 | davef
Major sources of crack in the solder connection after thermal cycling are: * Thermal heating caused by differences in thermal expansion between the board and the component * Lead-free solder is more rigid and brittle than eutectic solder in simila
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