Electronics Forum | Tue Nov 07 18:18:03 EST 2006 | Andrea
I am wondering how to move from hand soldering our ceramic caps to doing a reflow type process. The reason for the change is too many cracked ceramic caps. I have asked our vendors to assemble our boards via reflow but because of our hardware (swaged
Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray
I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W
Electronics Forum | Thu Dec 30 21:22:12 EST 1999 | Jim
Mike, Thanks for the reply. It's not really a matter of slope. It is the long term thermomechanical fatigue that the solder joint undergoes as a result of repeated severe temperature swings, while the product is in use. Non-leaded parts are suscep
Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef
Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.
Electronics Forum | Mon Feb 06 17:58:16 EST 2023 | davef
The September 29, 2022 Express Newsletter [ https://smtnet.com/express/index.cfm?fuseaction=archives&issue=20220929 ] has papers on chip cracking
Electronics Forum | Thu Feb 02 09:07:28 EST 2023 | charles_nguyen
Two types of land patterns used for surface mount pads are non-solder mask defined or NSMD pads and solder mask defined or SMD pads.Each type has its own advantages and disadvantages. There is a statement that SMD pad type may introduce stress concen
Electronics Forum | Wed Feb 08 09:43:08 EST 2023 | charles_nguyen
Thank you for the above information but what I want to talk about is the PCB design aspect. Should there be any warning about it in the DFM?
Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar
Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like
Electronics Forum | Fri Feb 17 19:23:05 EST 2023 | SMTA-64387083
Read the articles everyone else recommend. I haven't read of them but I will say this. A Solder Mask Defined pad is a copper flood that has much more thermal mass than a Non-Solder Mask Defined pad so it will heat and cool at a slower rate. I suspect
Electronics Forum | Fri Nov 03 09:31:35 EDT 2017 | davef
On the flux reside issue that is gumming up your test probe pogos ... Short term, clean what's in process with a aerosol flux cleaner solvent. Ask your flux supplier for recommendations. Longer term, recognizing that there is no fix, your improveme
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