Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Mon Mar 08 19:44:37 EST 2004 | Ken
I vote furnace is causing popcorn affect. Seen this many times over the last 4 years....especially if your buyers are buying parts on the "grey" market. Unless your running mechanical cenering machines (GOD I miss the Dynapert days)it's probably st
Electronics Forum | Thu Apr 10 05:25:43 EDT 2003 | dst
Hi, My company is currently experiencing a high feild failure rate on a 100nF chip ceramic that we use in various applications across our product range. One of them being de-coupling which means we use millions of this device every month. The failu
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Mon Mar 08 14:39:54 EST 2004 | Gabriele
Have you considered those Tant Caps could be moisture Sensitive Components ? During last year, several Brand Suplliers classified their Tant Caps as Moisture Sensitive Level 2a (4 wks out of dry pack before reflow, see J-STD-033a) some even MSL:3
Electronics Forum | Thu Jun 25 10:51:08 EDT 2020 | kumarb
How long have these devices been out of their sealed dry packs? Did you receive the devices factory new or from a broker of such parts? What may be happening is that moisture crept inside the device and there requires the parts to be baked before you
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
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