Electronics Forum | Thu Sep 17 23:36:35 EDT 2009 | Sean
All, We know that incomplete immersion silver could potentially lead this creeping corrosion. Is there any way to check bare PCB for incomplete immersion silver coverage, especially on the via hole area? Thanks, Sean.
Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean
Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr
Electronics Forum | Tue Sep 08 14:35:12 EDT 2009 | davef
Maybe your solder mask supplier can provide additional background
Electronics Forum | Thu Sep 03 14:21:29 EDT 2009 | davef
Creeping corrosion occurs on bare metal. Most commonly, it is seen on boards with thin protective coatings [eg, bare copper, immersion silver, organic solderability preservative]. Look here: * enthone.com/docs/AlphaSTARCreeping.pdf * circuitree.com
Electronics Forum | Fri Sep 04 07:26:23 EDT 2009 | Sean
Dear Davef, Thanks for sharing with me..I observed this creeping corrosion tend to appear on PCB via hole rather than other PCB location. Why this problem did not appear on PCB traces? Besides, I also notice that this problem only appear on the PC
Electronics Forum | Tue Nov 29 17:18:26 EST 2022 | davef
Yes, electronics manufacturing is a volume producer of cardboard waste. If the components are ESD-critical, cardboard and most plastics are not ESD safe. Static charges can be generated on these materials during handling by the friction of dissimila
Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper
The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when
Electronics Forum | Wed Dec 20 10:17:10 EST 2000 | markt
What steps are presently being taken by manufacturers to deal with problems such as layer bond strength, cold flow, and dimensial creep at present? Are there substantial materials research efforts, that you are aware of, in progress that address thes
Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
Electronics Forum | Tue Aug 14 21:48:54 EDT 2001 | davef
Say isn't creep a more key issue, rather than strength?
