Electronics Forum | Fri Jul 16 10:32:52 EDT 1999 | Upinder Singh
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin
| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z
Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani
Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f
Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira
We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche
Electronics Forum | Tue Apr 24 02:07:27 EDT 2001 | joe
It's not so much of a change but a new investment. We have Siplace lines now, and very pleased with the performance. The reason for looking at the Mydata is to remove all the small stuff from the faster lines and reduce changeover times. The idea is
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
