Electronics Forum: csp (Page 24 of 34)

CSP rework station advice needed

Electronics Forum | Wed May 30 14:14:31 EDT 2007 | jeremyl

We are making a socketed version of the boards, but it forces some compromises that will degrade performance. In talking to people (although admittedly most are rework vendors) the consensus is that with this small a part you pretty much need visio

CSP rework station advice needed

Electronics Forum | Wed May 30 18:34:08 EDT 2007 | russ

make your silkscreen accurate and you do not need vision vision is the reason for the high cost of this equipment. A part like you mention can easily be done with a temp controlled heat gun and a fixed height stand (about 300 dollars total)to hold t

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Feb 06 15:51:26 EST 2008 | jax

We have place CSP devices with 0.105mm standoff hights without any issue. The ability to Water Wash all depends on the specifications of your wash... Spray pressure and qty of jets Dwell time, pre-wash/wash/rinse Available detergents or saponifiers

Underfill 300balls BGA connector

Electronics Forum | Fri Sep 05 12:15:34 EDT 2008 | evtimov

All, Does anyone have experience with underfill > 300balls BGA connector? We have a component with > 300balls BGA connector that connectorize with > Flex. Customer wants to have an > underfill > > Questions - Possibility for > underfill 300ba

BGA Alignment

Electronics Forum | Wed May 09 13:19:53 EDT 2012 | markhoch

I'm with Dave on this one. In my opinion, it'd be much more cost effective to add an alignment legend. Speaking from experience, as I've hand placed many BGA's, all you really need to do is hit the pads. Even with Pb Free Chemistries, the part should

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 03:17:10 EST 2017 | rob

Ok, that's small - I think you may need a special semi-conductor printer for this - positional accuracy on a "normal" SMT printer is no more than 20 micrometres from memory. In my semiconductror fab days we were printing with a positional accuracy

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 11:33:37 EST 2017 | emeto

Joshua, 100um is 4mil aperture. You should ask several stencil houses about the possibility to print that small amount of paste(type 6 paste is available now with very small solder spheres 5-15um diameter). Even applying small amount(thin layer of f

Vacuum Reflow Oven

Electronics Forum | Tue Jun 26 16:07:12 EDT 2018 | eduszapata29

Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightne

Rework Station for Large PCBs

Electronics Forum | Tue Jul 24 07:37:35 EDT 2018 | fugtussey

PACE Worldwide has a new BGA Rework Station slated for production next month called the TF 2800. . It is based on the PACE's popular TF 1800 BGA & SMT Rework System (see TF1800 at http://www.paceworldwide.com/products/area-array-bga-rework/bga-rework

Re: Capability Study for Solder Printing Process

Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira

I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab


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