Electronics Forum | Thu Feb 25 18:06:04 EST 1999 | Chris Lampron
| No salesmen please. (I didn't use my real email address) | | I would like to know if anyone is using either of these SMT machines and if they are what input can you give me on them. We are looking at the Contact 3Z and the Multitroniks DHM for o
Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F
Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl
Electronics Forum | Sat Mar 03 09:48:27 EST 2001 | ghenning
Considering putting one of these into production. Any comments as to reliability, accuracy, programming ease, etc. greatly appreciated. Targeting small discretes (e.g. 0402), PBGA, CSP, & QFP (to 16 mil) Thanks in advance...
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
Electronics Forum | Tue May 18 03:03:34 EDT 1999 | Philip B.
| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | My experience i
Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte
| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Wed May 19 10:56:52 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | M
Electronics Forum | Wed May 12 10:38:51 EDT 1999 | Glenn Robertson
| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, My experience is primarily wi
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