Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so
Electronics Forum | Tue Jun 27 08:38:03 EDT 2006 | cuculi54986@yahoo.com
I tried some SN100C from AIM... On only one array. It flowed well on the chips but did not like the finish on the SOT23's on the board. I did not have enough arrays to mess around, so we switched it over to SAC305 and had no issues. I'm guessing w
Electronics Forum | Wed Oct 12 11:19:46 EDT 2005 | patrickbruneel
Yeah, adopting is the right word. In this new lead-free era spec.'s are made to stay within the scoop of the RoHS directive. The driving force for spec.'s should be reliability. Did you see any impurity level spec.'s yet in wave soldering for Cu, Au,
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Thu Apr 17 22:20:39 EDT 2003 | davef
Q1: Industry standard detailing solder joint quality? A1: ANSI/J-STD-001 - Requirements For Soldered Electrical & Electronis Assemblies is the mutha of industry standard detailing solder joint quality.
Electronics Forum | Tue Mar 14 20:42:24 EDT 2023 | stephendo
In a previous lifetime, we had a selective solder machine where I would see solder splashes in the roof of it. I thought someone might have been putting the solder extremely high. But when it was melting there would be bubbles that burst. The manufac
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Tue Mar 14 12:16:10 EDT 2023 | proceng1
Are these molten solder bubbles, or another substance "foaming" up on the surface?
Electronics Forum | Wed Mar 15 11:34:28 EDT 2023 | proceng1
I'm sure this isn't the same situation, but we did have a selective solder machine with crazy dross and solder ball build up. Turns out the operator switched the low pressure nitrogen line used for solder level and the high pressure nitrogen line fo
