Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm
My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Sun Jun 20 16:58:31 EDT 1999 | Chrys Shea
| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | Is your cubemate the same gu
Electronics Forum | Thu Sep 02 10:24:35 EDT 2004 | dj_jago
Greetings from the UK: I have been quite fortunate to lead (no pun intended) our company towards lead free sooner rater than later. One of our customers produces a product which is refurbushed every 6 months or so and sent back into the market. A
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Tue Nov 22 21:57:17 EST 2016 | Miche
Hello Dears, I'm a small CS Engineering at Taiwan.There are some problem on DIMM connector area with poor solderability at ODM. It was random on Dimm connector area and the SMT area is fine. At the same time, there were other PCB vendor's product whi
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
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