Electronics Forum | Tue May 16 11:53:39 EDT 2006 | Ajay
Hi, I am having trouble with outgasing voids on my solder bumps.Substrate is Cu with electrolytic Au on it.Sometimes I use electrolytic Ni beneath Au.I am doing laser soldering so this process is fluxless.Its been observed that Ni is helping in redu
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Tue Aug 07 20:43:47 EDT 2001 | davef
First, we know that MIL types are wont to use charts like that. Give �em Weibull distribution tables and then they�ll be happy, happy. A good book is Nelson �Accelerated Testing: Statistical Models �� Wiley Second, we don�t use that very nice stu
Electronics Forum | Sat Feb 12 06:10:48 EST 2011 | lafir
Flexible substrate coated by PR+, found many open trace. The Photo resist peels off from CU surface randomly creating open circuit during devolopement. Any ideas???
Electronics Forum | Tue Nov 07 10:25:19 EST 2000 | Thomas Ballhausen
Thank you for your kind contribution and efforts in helping me. I just found out we have been talking different units; my microns were micro meter ...? So, let me get things right now: the substrate supplier confirmed the following data: Cu foil +
Electronics Forum | Sat Oct 22 13:37:46 EDT 2016 | greglac
I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution. My requirements are as follows: 40um Line Width/Space Capability (or finer) 4 layers low loss at mm-wave
Electronics Forum | Fri Jan 21 19:20:31 EST 2022 | SMTA-64304163
Can someone who designs IMS printed circuit boards advise us on how to document the materials on the drawing. We are looking for applicable specifications to reference along with the physical specs. The current design is 066 +/-.006. .059 al, .0028
Electronics Forum | Wed Aug 18 05:09:56 EDT 1999 | Brian
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
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