Electronics Forum | Tue Mar 07 20:33:26 EST 2023 | SMTA-72027903
Hello We have recently started to work with press fit but we are finding problems to reach the specifications in terms of hole deformation and whiskers. Do someone have experience in key process parameters and PCB design specifications (PCB harness,
Electronics Forum | Thu May 25 08:47:39 EDT 2006 | inds
Patrick, we were seeing a good amount of Cu-dissolution with both SAC305 and SN100C.. couldn't figure out.. till our good old vendors told us that the Cu thickness in the barrel were not correct... but anyway have started some new work with SAC30
Electronics Forum | Wed Sep 03 07:43:13 EDT 2008 | davef
What do you mean by a "few micron thick"? IMC thickness pre-cycling (NEMI Lead-free) * Cu3Sn: 3um [118 uin] * Cu6Sn5: 1um [40 uin]
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Fri Oct 03 05:27:24 EDT 2003 | kanwal324
the puspose of solder mask is to prevent exposure of cu tracks to atmosphere. the lesser thickness can effect the performance of board but it only depends on its application. if you are making telecom board then its not good to use the board.
Electronics Forum | Mon Jan 21 09:29:33 EST 2013 | cnotebaert
I agree, you will likely need a carrier being that thin. without seeing the trace layout I’m not sure about relieving the carrier to accommodate them. if evenly distributed you shouldn’t to go that far. Are parts on both sides of the board? Don’t mak
Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef
You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2
Electronics Forum | Wed Nov 17 10:03:29 EST 2010 | scottp
Instead of a minimum thickness, we require no exposed copper or SnCu intermetallic. We've been having a lot of trouble lately with suppliers of SN100 HASL boards giving us pads with very irregular solder deposits with areas of exposed intermetallic.
