Electronics Forum | Thu Feb 22 12:26:33 EST 2001 | traviss
I used a Blue M batch oven quite a bit to cure in works great. All you have to do is get the board up to cure temperature, 150C normally and your all set. It will probably be in there longer than the time required but at that low temperature it shoul
Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
Electronics Forum | Wed Feb 21 21:21:10 EST 2001 | davef
Gary: It doesn't matter what you use to cure your glue. SMA adhesives are thermosets. This means they become hard on cure and this is not reversible. A couple of things go on with SMA adhesives when you heat them. * Their rheology is temperature
Electronics Forum | Thu Feb 22 09:56:21 EST 2001 | blnorman
An adhesive, is an adhesive, is an adhesive. Yes most will thin when exposed to elevated temperature, but that's only for a short time. As cross-linking starts, viscosity increases. Having made countless numbers of adhesively bonded samples in the
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Thu Nov 15 22:10:16 EST 2007 | davef
Questions are: What is: * Purpose of this PCB ink? * Meaning of 'non-conductive?' * Temperature of your laser? * Reason solder mask is not the product of first choice? * Space of the unsoldered region located between soldered areas? * Maximum cure te
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Wed Feb 08 03:35:58 EST 2006 | GS
100�C) the moisture changes in vapour/gas generating an internal pressure causing in the worst case damages like internal planes delamination, popcorn effects, degassing, ecc. So you can understand why before reflow it could be necessary to backe and
Electronics Forum | Wed Nov 28 07:41:10 EST 2007 | davef
DevGru: Questions are: * What steps do you recommend taking to "watch out for the exothermic heat from the curing?" * What are typical temperatures for exothermic heat from the curing? * What is the duration of such temperatures? * Do epoxy suppliers
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