Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Tue Jul 19 06:07:30 EDT 2005 | GS
Yes Rob, I would like to know the type of metal finisching like JST097 or IPC-1066 or IEC .... suggest to do. I would like to avoid i.e. to get Bismuth finish on components terminals that I still have to solder with alloy containing Pb. Also to ha
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Wed May 24 16:47:21 EDT 2006 | patrickbruneel
Inds, It's about time that lead-free components can stand higher temps "myth" stops. The only difference is the plating, the component itself has not changed. Can you give us an update on this threat? If you�re the same inds http://www.smtnet.com//
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Wed Dec 15 16:38:42 EST 2004 | patrickbruneel
Here's my 10 cents Studies done in the 1980's concluded that pure tin was prone to whisker generation. A tin content lower then 70% became exempt from this phenomenon. I have never seen or done any studies on the impact lead had in reducing the pote
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Fri Dec 31 10:22:54 EST 2004 | gpaelmo
I agree that something has to be done with the lead waste but I believe that a recycling program is a better alternative to lead-free. Isn't silver more toxic? How about the venting of alternate alloy fumes, let alone the effects on operators. I say
Electronics Forum | Thu Mar 23 16:07:39 EST 2006 | russ
Who exactly is supporting this anyway? I know it came out of europe for SOME REASON none of which I beleive are really about the environment. But I have not heard any positive from anyone at anytime as to why this is being implememted in such a hal
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
