Electronics Forum | Fri Feb 28 12:02:15 EST 2003 | MA/NY DDave
Hi You are right. I guess some of us missed this point in the way this on line dialog works. I like to put the specification that the PCB supplier must adhere to, on the Physical Print. The Physical print is often used by outgoing and incoming insp
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Fri Sep 12 14:47:10 EDT 2003 | Dominador Sagun
Run a deviation until next customer ECO.
Electronics Forum | Wed Nov 05 17:07:17 EST 2003 | babe
You folks are AMAZING. Thank you very much for all of your input. Hope it helps the customer.
Electronics Forum | Thu Feb 12 11:35:17 EST 2004 | Kris
what is the composition of the paste and ball ? Interesting to know why the customer is asking you to look for it Thx
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Thu Aug 05 16:07:51 EDT 2004 | davef
Did you record the thermal recipe on the ball that your customer complained as open or some other ball?
Electronics Forum | Thu Aug 05 22:07:53 EDT 2004 | davef
Smart customer. Maybe an application type at the supplier of your "overlay Lexan Material " can make salient recommendations.
Electronics Forum | Tue Oct 05 10:36:28 EDT 2004 | palmerg
Sounds Interesting. Can you share the paper when you are done ?
Electronics Forum | Mon Nov 08 13:42:07 EST 2004 | steve
As usual, a big thank you for the education. You make me look good in front of the customer.
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