Electronics Forum | Thu Mar 27 16:14:24 EDT 2008 | mikesewell
If you get into a discussion with a Lean guy/gal, takt will be the rate of customer demand. People often use takt & cycle time synonymously...FWIW
Electronics Forum | Thu Aug 26 13:20:56 EDT 2004 | pjc
Machine design plays a major factor in actual placement rate vs. the published tact time max speed. For example, random access horizontal turret head machines can vary greatly depending on nr. of different components and size ranges, while the dual g
Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Mon Apr 17 15:39:35 EDT 2023 | tey422
That's depend on how many wash cycles you would need to completely cleans the board within 1 batch. Most of times you would need more than 2 wash cycles (that's already about 30 mins just 2 wash cycles), it can be up to 5 wash cycles alone. Also kee
Electronics Forum | Wed May 06 09:16:51 EDT 1998 | justin medernach
| I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventua
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Thu Mar 15 13:39:06 EDT 2018 | gregp
Impact is the instantaneous force at the time the component first reaches the PCB. F=M*a....so the acceleration is the key factor. If charted on a graph it would look like a spike...higher force for a short duration. The placement force is typical
Electronics Forum | Mon Feb 21 08:44:10 EST 2011 | kahrpr
They all are inlineish They just carry the board to the vapor chamber. in a reflow system all the boards in the oven from beginning to end are in state of process, which gives you more speed. If the board has a long cycle time VP is not a problem. If
Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun
The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /
