Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Mon Jun 28 22:44:13 EDT 2004 | davef
Q1: What is the most popular PCB finish for lead-free soldering ? A1: We'd guess ENIG Q2: Who drives the selection of the finish, assembler or designer ? A2: A tight circle of recrimination, blame letting, and other human ills that is primarily driv
Electronics Forum | Fri Jun 03 16:40:48 EDT 2005 | Andrea
I have a customer who has put a restriction against pure tin finish components. We have gotten our BOMs compliant with all but 5 parts. Fairchild p/n FDD6512A, FQD12N20C, IRLM120A Bournes 3214G-1-501E Sprague 10TS-D10 I am looking for a standard pr
Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring
Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th
Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef
In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of
Electronics Forum | Mon Apr 27 14:39:38 EDT 2015 | davef
Anirudh: When board fabs talk "surface finishing" they're talking about the solderability protection that you'd like on the solderable copper component mounting pads that you laid-out for each component: * Bare copper pads corrode very quickly * Corr
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Thu Apr 19 08:50:38 EDT 2007 | rgduval
Welcome to RoHS. Or, at least, to the version of RoHS that I've had to deal with since I started with my current company. Blowholes and pinholes seem to be common in PB-free manufacturing. At least, they have for me here. I also note that IPC has
Electronics Forum | Wed Jan 05 11:11:09 EST 2000 | Dave F
Hey Pat: My responses are: 1. Does anyone have experience with the shelf life on immersion white tin? If so, how long can the boards be stored without adversely affecting solderability. I've heard one year. No, we don�t, because we turn boards fa
